Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-resolution TR7700QE-S 3D AOI for the Semiconductor and Packaging Industry.
As the miniaturization of components and PCB boards increases, also does the demand for higher resolution inspection. The TR7700QE-S provides high accuracy and repeatability for the semiconductor & packaging industry. TRI inspection platforms have robust metrology capabilities that enable high accuracy and reliability inspection, lowering the false calls rates.
The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry.
Achieve true 3D profile measurement using Multiphase lighting and Blue Angled Laser. Interactive 3D models help operators quickly review found defects, such as die crack, excess epoxy, broken wire bonding, lifted BGA components, IC leads, connectors, switches, and other mounted devices for enhanced post-reflow inspection.
The TR7700QE-S enables metrology inspection; easily create formulas with dimensional measurements, inspection parameters, and real measurement values.
The AI-powered algorithms of the TR7700QE-S detect wire bonding defects, such as unbounded, missing wire, broken wire, wedge placement, ball-off pad, ball diameter, and more.
The TR7700QE-S is a smart factory solution, allowing operators to aggregate information from individual systems for statistical analysis of production line defects rates, reviewing and fine-tuning inspection results, and identifying component defect trends and emerging production issues.
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